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Technical Program Committee Jianping An, Beijing Institute of Technology, China Nirwan Ansari, NJIT, USA Andrea Bianco, Politecnico di Torino, Italy Isabella Cerutti, Scuola Superiore Sant'Anna, Italy Chung-Ju Chang, National Chiao Tung University, Taiwan Periklis Chatzimisios, TEI of Thessaloniki, Greece Jyh-Cheng Chen, National Tsing Hua University, Taiwan Xiao Chen, Texas State University, USA Xiuzhen Cheng, George Washington Univ, USA Baek-Young Choi, "University of Missouri, Kansas City", USA Tarik Cicic, University of Oslo, Norway Qiang Duan, University of Central Arkansas, USA Tarek El-Ghazawi, The Goerge Washington University, USA Itamar Elhanany, University of Tennessee, USA Vincenzo Eramo, "University of Rome ""La Sapienza""", Italy Wenying Feng, Trent University, Canada Andrea Francini, "Bell Labs, Alcatel-Lucent", USA Mario Freire, University of Beira Interior, Portugal Paolo Giaccone, Politecnico di Torino, Italy Zhen Guo, IWT, USA Qun Hao, Beijing Institute of Technology, China Hiroaki Harai, National Institute of Information and Communications Technology, Japan Si-Min He, Chinese Academy of Sciences, China Thomas Hou, Virginia Tech, USA Gongzhu Hu, Central Michigan University, USA Joseph Hui, Arizona State University, USA Andrzej Jajszczyk, AGH University of Science and Technology, Poland Abbas Jamalipour, University of Sydney, Australia Brigitte Jaumard, Concordia University, Canda Xiaohua Jia, City Univ. of Hong Kong, Hong Kong Xiaohong Jiang, University of Tohoku, Japan Mark Karol, Avaya Inc, USA Jouni Karvo, Helsinki University of Technology, Finland Manolis Katevenis, FORTH-ICS and University of Crete, Greece Dongkyun Kim, Kyungpook National University, Korea Aleksandar Kolarov, Telcordia Technologies, USA Sarvesh Kulkarni, Villanova University, USA Hyoung-Il Lee, The Korean Intellectual Property Office, South Korea Yihan Li, Auburn University, USA Qun Li, College of William and Mary, USA Yingshu Li, Georgia State University, USA Qilian Liang, University of Texas at Arlington, USA Hyesook Lim, Ewha Womans University, South Korea Jingxuan Liu, Frostburg State University, USA Bin Liu, Tsinghua University, China Pascal Lorenz, University of Haute Alsace, France Enyue Lu, Salisbury University, USA Maode Ma, Nanyang Technological University, Singapore Shiwen Mao, Auburn University, USA Brian Mark, George Mason University, USA Lotfi Mhamdi, Delft University of Technology, Netherlands Cyriel Minkenberg, IBM Zurich Research Laboratory, Switzerland Nader Mir, San Jose State University, USA Jelena Misic, University of Manitoba, Canada Vojislav Misic, University of Manitoba, Canada Masayuki Murata, Osaka University, Japan Hajime Nakamura, KDDI R&D Laboratories Inc., Japan Srihari Nelakuditi, University of South Carolina, USA Satoru Okamoto, Keio University, Japan Eiji Oki, NTT, Japan Teunis Ott, Rutgers University, USA Shivendra Panwar, Polytechnic University, USA Achille Pattavina, Politecnico di Milano, Italy James Roberts, France Telecom, France Roberto Rojas-Cessa, New Jersey Institute of Technology, USA Arunabha Sen, ASU, USA Fengjing Shao, Qingdao University, China Sachin Shetty, Old Dominion University, USA Kohei Shiomoto, NTT, Japan Aleksandra Smiljanic, "Belgrade University, Stony Brook University", Serbia and Montenegro Arun Somani, Iowa State University, USA Min Song, Old Dominion University, USA Dimitrios Stiliadis, "Bell Labs, Lucent Technologies", USA Shensheng Tang, George Mason University, USA Ioannis Tomkos, AIT, Greece Danny H. K. Tsang, Hong Kong University of Science and Technology, Hong Kong Bin Wang, Wright State Univ, USA Godfried Williams, University of East London, United Kingdom Muqing Wu, BUPT, China Chunsheng Xin, Norfolk State University, USA Kevin Xu, EMC Corporation, USA Guoliang Xue, Arizona State University, USA Naoaki Yamanaka, Keio University, Japan Houjun Yang, Qingdao University, China Jie Yang, Spirent Communications, USA Yang Yang, University College London (UCL), United Kingdom Kwan Yeung, University of Hong Kong, Hong Kong Jun Zheng, University of Ottawa, Canada Si-Qing Zheng, University of Texas at Dallas, USA Dongli Zhang, Hyperchip Inc., Canada |